? semiconductor components industries, llc, 2015 november, 2015 ? rev. 0 1 publication order number: ncp2817/d ncp2817 nocap longplay headphone amplifier ncp2817 is a dual longplay true ground headphone amplifier designed for portable communication device applications such as mobile phones. this part is capable of delivering typical 27 mw of continuous average power into a 32 load from a 1.8 v power supply with a thd+n of 1%. based on the power supply delivered to the device, an internal power management block generates a symmetrical positive and negative voltage. thus, the internal amplifiers provide outputs referenced to ground and the losses are reduced which helps to increase the battery life. in this nocap configuration, the two external heavy coupling capacitors can be removed. it offers significant space and cost savings compared to a typical stereo application. ncp2817 is available with internal gain of ?1.5 v/v. it reaches a superior ?100 db psrr and noise floor. thus, it offers high fidelity audio sound, as well as a direct connection to the battery. it contains circuitry to prevent from ?pop & click? noise that would otherwise occur during turn?on and turn?off transitions. the device is available in 12 bump csp package (1.62 x 1.22, 0.4p) which helps to save space on the board. features ? nocap output eliminates dc?blocking capacitors: ? saves board area ? saves component cost ? no low?frequency response attenuation ? longplay architecture: increase the battery life ? high psrr (?100 db): direct connection to the battery ? high snr performance (100 db) ? ?pop and click? noise protection circuitry ? internal gain (?1.5 v/v) or external adjustable gain ? ultra low current shutdown mode ? high impedance mode ? 1.6 v ? 5.5 v operation ? thermal overload protection circuitry ? csp 1.62 x 1.22, 0.4p ? these devices are pb?free, halogen free/bfr free and are rohs compliant typical applications ? headset audio amplifier for ? cellular phones ? mp3 player ? personal digital assistant and portable media player ? portable devices www. onsemi.com see detailed ordering and shipping information on page 9 o f this data sheet. ordering information 12 pin csp fc suffix case 499bj marking diagram 817bc alyww a = assembly location l = wafer lot y = year ww = work week = pb?free package pin assignment a1 b1 c1 a2 a3 a4 b2 b3 b4 c2 c3 c4 cpm pvm inl inr pgnd /sd agnd sgnd cpp vp outl outr (top view) 12?pin 1.2 x 1.6 mm csp
ncp2817 www. onsemi.com 2 + ? + ? pop & click suppression biasing power management & charge pump /sd figure 1. block diagram in l in r v rm v rp v p c pp c pm v rp v rm v rp v rm p vm p gnd out l out r a gnd s gnd pin function description pin pin name type description a1 c pm input / output charge pump flying capacitor negative terminal. a 1 f ceramic capacitor to c pp is required a2 p vm output charge pump output. a 1 f ceramic capacitor to ground is needed a3 in l input left input of the audio source a4 in r input right input of the audio source b1 p gnd ground power ground. this pin should be connected directly to the ground plane. b2 /sd input enable activation. b4 s gnd ground sense ground. connect to shield terminal of headphone jack or ground plane. c1 c pp input / output charge pump flying capacitor positive terminal. a 1 f ceramic capacitor to c pm is required c2 v p power positive supply voltage. connected to single secondary cell lithium?ion battery or any other kind of power supply c3 out l output left audio channel output signal c4 out r output right audio channel output signal b3 a gnd ground analog ground. this pin should be connected directly to the gnd plane. careful layout and no direct connection to other ground pins are required to ensure good noise immunity
ncp2817 www. onsemi.com 3 maximum ratings rating symbol value unit v p pin: power supply voltage (note 1) v p ?0.3 to + 6.0 v /sd pin: input v mr1 ?0.3 to v p + 0.3 v human body model (hbm) esd rating are (notes 2 and 3) esd hbm 2000 v machine model (mm) esd rating are (note 2 and 3) esd mm 200 v csp 1.62 x 1.22, 0.4p package (note 6 and 7) thermal resistance junction to case r jc (note 7) c/w operating ambient temperature range t a ?40 to + 85 c operating junction temperature range t j ?40 to + 125 c maximum junction temperature (note 6) t jmax + 150 c storage temperature range t stg ?65 to + 150 c moisture sensitivity (note 5) msl level 1 stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. maximum electrical ratings are defined as those values beyond which damage to the device may occur at t a = 25 c. 2. according to jedec standard jesd22?a108b. 3. this device series contains esd protection and passes the following tests: human body model (hbm) 2.0 kv per jedec standard: jesd22?a114 for all pins. machine model (mm) 200 v per jedec standard: jesd22?a115 for all pins. 4. latch up current maximum rating: 100 ma per jedec standard: jesd78 class ii. 5. moisture sensitivity level (msl): 1 per ipc/jedec standard: j?std?020a. 6. the thermal shutdown set to 150 c (typical) avoids irreversible damage on the device due to power dissipation. 7. the r ca is dependent on the pcb heat dissipation. the maximum power dissipation (p d ) is dependent on the min input voltage, the max output current and external components selected. r ca 125 t a p d r jc electrical characteristics min & max limits apply for t a between ?40 c to +85 c and t j up to + 125 c for v p = 3.6 v (unless otherwise noted). typical values are referenced to t a = + 25 c and v p = 3.6 v. symbol parameter conditions min typ max unit v battery supply voltage range 1.6 5.5 v i sd shutdown current 1 a i q quiescent current v p = 1.8 v 2.3 3.0 ma r in input resistance 7.5 10 12.5 k r sd /sd pull?down resistor 300 k maximum input signal swing 2.8 v pp v ih high?level input voltage sd pin 1.2 v v il low?level input voltage sd pin 0.4 v uvlo uvlo threshold falling edge 1.4 v uvlo hys uvlo hysteresis 100 mv t sd thermal shutdown temperature 160 c v os output offset voltage input ac grounded 0.5 mv t wu turning on time 1 ms v lp max output swing (peak value) v p = 1.8 v, headset = 32 1.13 v peak p o max output power (note 8) v p = 1.8 v, thd+n = 1% headset = 16 headset = 32 20 41 27 mw 8. guaranteed by design and characterized. 9. typical application circuit as depicted
ncp2817 www. onsemi.com 4 electrical characteristics min & max limits apply for t a between ?40 c to +85 c and t j up to + 125 c for v p = 3.6 v (unless otherwise noted). typical values are referenced to t a = + 25 c and v p = 3.6 v. symbol unit max typ min conditions parameter p o max output power v p = 3.6 v, thd+n = 1% headset = 16 headset = 32 42 27 mw crosstalk (note 8) headset 16 ?95 ?80 db psrr power supply rejection ratio inputs shorted to ground f = 217 hz to 1 khz ?100 db thd+n total harmonic distortion + noise headset = 16 p out = 10 mw, f = 1 khz 0.02 % thd+n total harmonic distortion + noise headset = 32 p out = 10 mw, f = 1 khz 0.02 % thd+n total harmonic distortion + noise headset = 32 v outr ? v outl = 400 mv, f = 1 khz ?80 db snr signal to noise ratio 100 db z sd output impedance in shutdown mode 12 k max channel to channel gain tolerance b version only t a = +25 c ?2 0.3 +2 % f sw1 headset charge pump switching fre- quency p out > 500 w 1 mhz f sw2 headset charge pump switching fre- quency p out < 500 w 125 khz a v voltage gain ?1.54 ?1.5 ?1.46 v/v 8. guaranteed by design and characterized. 9. typical application circuit as depicted
ncp2817 www. onsemi.com 5 typical operating characteristics 0.001 0.01 0.1 1 10 100 1000 10k 100k figure 2. thd+n vs frequency @ p out = 10 mw, r l = 32 , v p = 1.8 v figure 3. thd+n vs frequency @ p out = 10 mw, r l = 16 , v p = 1.8 v figure 4. thd+n vs p out @ 25 c load = 32 , v p = 1.8 v figure 5. thd+n vs p out @ 25 c load = 16 , v p = 1.8 v figure 6. psrr vs frequency @ v p = 3.6 v figure 7. crosstalk vs. frequency @ v p = 3.6 v p out = 10 mw frequency (hz) thd+n (%) frequency (hz) thd+n (%) p out (w) thd+n (%) p out (w) thd+n (%) frequency (hz) crosstalk (db) frequency (hz) crosstalk (db) right left 0.001 0.01 0.1 1 10 100 1000 10k 100k right left right left 0.001 0.01 0.1 1 0.001 0.01 0.1 10 100 1 10 0.001 0.01 0.1 1 10 0.01 0.1 10 100 1 right left right left 10 100 0 ?20 ?40 ?60 ?80 ?100 ?120 ?140 1000 10k 0 ?20 ?40 ?60 ?80 ?100 ?120 10 100 1000 10k right left
ncp2817 www. onsemi.com 6 typical operating characteristics figure 8. quiescent current vs v p (v p rising) figure 9. power dissipation vs p out @ 25 c (p out left + right) figure 10. maximum output power vs v p (thd+n < 1%, r l = 32 ) figure 11. maximum output power vs v p (thd+n < 1%, r l = 16 ) v p (v) i q (ma) p out (mw) p dis (mw) v p (v) (mw) v p (v) (mw) 3.0 2.5 2.0 1.5 1.0 0.5 0 1.5 5.5 4.5 3.5 2.5 0 100 200 300 400 500 600 700 0 20 40 60 80 100 120 140 v p = 1.6 v v p = 1.8 v v p = 2.5 v v p = 3.6 v v p = 4.2 v v p = 5 v v p = 5.5 v 0 5 10 15 20 25 30 35 40 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0 10 20 30 40 50 60 70 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
ncp2817 www. onsemi.com 7 detail operating description c fly audio left input audio right input + ? + ? pop&click suppression biasing power management & charge pump figure 12. typical application circuit /sd in l in r v p c pp c pm p vm p gnd out l out r a gnd s gnd v rp v rm v rp v rm c pm v rp v rm v battery c inl c inr detailed descriptions the ncp2817 stereo headphone amplifier features the on semiconductor nocap architecture that eliminates the large output dc?blocking capacitors required by conventional headphone amplifier. an integrated power supply block generates low noise positive (v rp ) and negative (v rm ) voltages from the positive supply voltage (v p ). the stereo headphone amplifiers operate from these symmetrical supplies. amplifiers output are referenced to ground (gnd), instead of dc voltage (typically v p /2) for conventional headphone amplifiers. the ncp2817 integrates two true ground amplifiers, an under v oltage lock out (uvlo), a short circuit protection and a thermal shutdown circuitry. in addition, a special circuit is embedded to eliminate pop and click noise that occurs during turn on and turn off time. ncp2817 has an embedded gain setting network set to 1.5 v/v. nocap tm nocap is a patented architecture which requires only two small ceramic capacitors. from single positive only rail, it generates the symmetrical positive and negative rails that supplies amplifiers output stage. this feature allows the output of the amplifiers to be biased around the ground level and eliminates need of huge dc voltage blocking capacitors. longplay architecture the ?longplay? feature, based on unique ultra low current consumption architecture saves more battery life by reducing the quiescent current depending on the load. current limit protection circuit the ncp2817 output power stage features a protection circuitry against short to ground. the current is limited to 300 ma typical when an output is shorted to gnd and a signal is applied to the input. thermal overload protection internal amplifiers are switched off when the temperature exceed 160 c, and will be switched back on when the temperature decreases below 140 c.
ncp2817 www. onsemi.com 8 under voltage lockout when the battery voltage decreases below 1.4 v, the amplifiers are turned off. the hysteresis to turn back on the device is 100 mv. pop and click suppression circuitry the ncp2817 includes a special circuitry to eliminate any pop and click noise during turn on and turn off time. during uncontrolled turn on and turn off sequences, normal amplifiers would create an output offset. this offset drives the loudspeaker and generates a parasitic noise called ?pop and click noise?. the ncp2817 carefully controls the amplifier output stages during turn on and off sequences to eliminate this problem. input capacitor selection the input coupling capacitor blocks the dc voltage at the amplifier input terminal. this capacitor creates a high?pass filter with the r in input resistor (10 k for ncp2817). the size of the capacitor must be large enough to cut off low frequencies without severe attenuation in the audio bandwidth (20 hz ? 20 khz). the cut off frequency for the input high?pass filter is: f c 1 2 r in c in with r in = 10 k a f c < 20 hz is recommended. charge pump capacitor selection use ceramic capacitor with low esr for better performances. x5r / x7r capacitor is recommended. the c fly flying capacitor serves to transfer charge during the generation of the negative voltage and directly affects load regulation and charge pump output impedance. a too low value results in poor current performance while higher value increases charge pump regulation and lowers output impedance (until internal switches r ds(on) becomes predominant). we recommend 1 f, but lower values can be uses in systems with lower audio power requirements. the c pvm capacitor must be equal at least to the c fly capacitor to allow maximum transfer charge. in addition, the esr of c pvm capacitor directly affects ripple on p vm as well as charge pump output impedance. we recommend 1 f, but lower values can be uses in systems with lower audio power requirements. table 1. suggest typical value and manufacturer value reference package manufac- turer 1 f c1005x5r0j105k 0402 tdk 1 f grm155r60j105k19 0402 murata power supply decoupling capacitor (c1) the ncp2817 is a nocap amplifier and proper power supply bypassing is critical to reduce noise, high thd+n and psrr performances. it is recommended to use a 1uf x5r / x7r ceramic capacitor and place it as close as possible to the v p pin. shutdown function the device enters in shutdown mode when shutdown signal is low. during the shutdown mode, the dc quiescent current of the circuit does not exceed 1 a. in this configuration, the output impedance is 20 k on each output. layout recommendation minimize trace impedance of the power, the ground and all output traces. the voltage drop between ncp2817 and the headset load results in decrease of output power and efficiency. we strongly recommend using wide traces for power supply inputs to optimize the power supplies efficiency and regulation performances. good ground connection improves the amplifier immunity to external switching noise, improves crosstalk between channels as well as general audio performances. we also recommend wide pcb traces for the power outputs routing. if possible, we recommend to use local ground and power planes. the power supply decoupling capacitor c byp will help to minimize the input voltage ripple during fast load transients. it is important to minimize traces impedances from c byp to gnd plane and from c byp to v p pin as close as possible of the v p pin. c byp should be placed as close as possible to the v p pin. the charge pump creates the vpm negative voltage that supplies the amplifiers. c fly and c pvm capacitors location and access impedances are also critical. connect c fly and c pvm as close as possible of the ncp2817 and route their terminal to the associated pin w ith wide traces to minimize impedance and optimize the charge pump ripple and efficiency performances. in addition, the c fly and c pvm capacitors as well as the traces connecting capacitors to the device should be kept away from the audio input and output traces to avoid any switching noise coupling with the audio signal. a gnd is the ground reference for all internal analog features so, particular attention should govern the a gnd pin connection to the ground reference plane. a gnd pin should be directly connected to the board ground reference plane and keep it separated from other ground connections. the a gnd to gnd ground reference plane trace should not be shared with the trace between s gnd or p gnd and the ground plane.
ncp2817 www. onsemi.com 9 ordering information device package shipping ? NCP2817BFCCT2G wlcsp12 (pb?free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
ncp2817 www. onsemi.com 10 package dimensions 12 pin flip?chip, 1.62x1.22, 0.4p case 499bj issue b *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. seating plane 0.10 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. coplanarity applies to spherical crowns of solder balls. 2x dim a min max 0.50 millimeters a1 a2 d 1.62 bsc b 0.24 0.29 e 0.40 bsc 0.56 a b pin a1 reference a 0.05 b c 0.03 c 0.05 c 12x b 1234 c b a 0.10 c a a1 a2 c 0.17 0.23 e d e/2 e 0.10 c 2x 12x note 3 top view side view bottom view 0.33 0.39 e 1.22 bsc 12x 0.26 a1 recommended soldering footprint 0.40 pitch 0.40 pitch package outline dimension: millimeters on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s pr oduct/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 ncp2817/d nocap is a trademark of semiconductor components industries, llc (scillc). literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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